Job Details

Japanese Bilingual Filed Application Engineer

Responsibilities

• Present detailed technical product presentations to key customer engineers at different level in multiple meetings, working toward design-in products
• Deep technical strengths in device physics of magnetic semiconductor components
• Strong communication skills; should find it enjoyable working with engineers and technology
• Work closely with colleagues in engineering, sales and marketing teams to provide technical support during all stages of the product life cycle
• Work closely with customers during the design phase, understanding the full scope of the customers’ requirements to help guide the development teams
• Work closely with the development teams to assist in the validation process
• Participate in new product design reviews both internally and externally
• Participate in supporting factory audits and customer visits internationally

Qualifications

• Strong knowledge of semiconductor device processing and core electrical engineering concepts
• Technical background and knowledge of:
• Magnetic device design, process and characterization: Magnetic sensor design and modeling; Si or compound semiconductor front and back-end process technology; device characterizations such as sensitivity, linearity, temperature and noise characterization
• Prior customer engagement experiences with ability to make detailed technical presentations in concise and timely manner to customers
• Fluent in both English and Japanese (written/oral) for technical engagements with our Japanese counterparts
• Ability to travel internationally as much at 5~6x/year to accommodate customer visits and factory audits
• Preferred Requirements/Skills:
• Experience in failure analyses and reliability of device physics
• Failure analysis equipment knowledges such as SEM/EDX, OBIRCH, FT-IR spectroscopy
• Ability to highlight technical gaps between customer requests and internal capabilities in resolving issues

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